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Current location:Home > Titanium|Application > Ti · Dynamic > Top 10 Common High Temperature Sputtering Target Materials!

Top 10 Common High Temperature Sputtering Target Materials!

Release time:2024-12-25 丨 Views:0235

High temperature resistant sputtering targets play a key role in many high-tech fields, especially in application scenarios that require high temperature stability. The following is an introduction to the top ten high-temperature sputtering target materials:

Molybdenum and molybdenum alloy target materials

Characteristics: Molybdenum is a silver gray metal with a melting point of up to 2623 ° C and a density of 10.2g/cm 3. Molybdenum and its alloys have advantages such as high melting point, good electrical and thermal conductivity, low thermal expansion coefficient, excellent corrosion resistance, and environmental friendliness.

Application: Molybdenum and molybdenum alloy target materials have been widely used in fields such as electronics, solar cells, and glass coating.

Ruthenium metal target material

Characteristics: Ruthenium target material has good heat resistance, corrosion resistance, and mechanical strength, suitable for use in high temperature, high pressure, and corrosive environments.

Preparation process: Ruthenium powder is loaded into a graphite mold, compacted and pressed, and then placed in a vacuum hot pressing furnace for unidirectional hot pressing sintering. The sintering process is carried out under a protective gas atmosphere, with a sintering temperature of 1600-1800 ℃ and a sintering pressure of 5-20MPa.

Application: Ruthenium target material can be used for thin film deposition of electronic devices, as well as preparation of optical thin films and optical coatings.

Ultra high purity aluminum sputtering target material

Characteristics: Aluminum target materials have high purity and excellent conductivity, suitable for the preparation of conductive and barrier layers in semiconductor devices.

Market situation: It is expected that the global market size of ultra-high purity aluminum sputtering targets will reach 380 million US dollars by 2029, with a compound annual growth rate (CAGR) of 5.6%.

Copper indium gallium selenide (CIGS) target material

Characteristics: CIGS target materials are mainly used in the production of thin-film solar cells.

Application: With the rapid development of the solar energy industry, the demand for CIGS target materials is also increasing.

Indium tin oxide (ITO) target material

Characteristics: ITO targets are mainly used to manufacture transparent conductive films and are widely used in touch screens and flat panel displays.

Market position: With the continuous growth of demand for consumer electronics products, the market position of ITO target materials is becoming increasingly important.

Tungsten target material

Characteristics: Tungsten has a high melting point (3422 ° C) and excellent wear resistance, making it suitable for sputtering deposition of high-temperature and wear-resistant materials.

Application: Tungsten target materials are widely used in fields such as semiconductors, electronic devices, and wear-resistant coatings.

Titanium target material

Characteristics: Titanium target material has good corrosion resistance and biocompatibility, suitable for sputtering deposition of medical devices and biosensors.

Application: With the continuous development of medical technology, titanium target materials have broad prospects in the field of medical devices.

Tantalum target material

Characteristics: Tantalum target material has a high melting point (2996 ° C) and excellent chemical stability, suitable for sputtering deposition of high-temperature and chemically stable materials.

Application: Tantalum target materials are widely used in electronic devices, aerospace, and chemical industries.

Niobium target material

Characteristics: Niobium target material has a high melting point (2468 ° C) and excellent superconducting properties, suitable for sputtering deposition of superconducting materials and electronic devices.

Application: Niobium target materials are widely used in superconducting materials, electronic devices, and aerospace fields.

Zirconium target material

Characteristics: Zirconium target material has good corrosion resistance and biocompatibility, as well as a high melting point (1852 ° C), making it suitable for sputtering deposition of corrosion-resistant and biocompatible materials.

Application: Zirconium target materials are widely used in fields such as medical devices, chemical equipment, and electronic devices.

In summary, the top ten high-temperature sputtering targets mentioned above have their own characteristics and are widely used in various fields such as semiconductors, optics, photovoltaics, electronic devices, medical equipment, etc. With the advancement of technology and changes in market demand, the research and development of these target materials is moving towards higher performance, lower cost, and more environmentally friendly directions.

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